The RGA series covers 12 TO-247N package parts and 10 bare wafer devices, ROHM’s initial 650V IGBT lineup for auxiliary EV and industrial inverter circuits
(Image courtesy of ROHM Semiconductor)
ROHM has introduced 4th generation 650V IGBTs for automotive electric compressors, HV heaters and industrial equipment inverters. The automotive-grade devices reach a collector-emitter saturation voltage of 1.55V, a figure ROHM describes as class-leading in its August 2026 study, while holding a 7 microsecond short-circuit withstand time at 25°C junction temperature. The parts comply with the AEC-Q101 automotive reliability standard.
Redesigned structure targets the loss and tolerance trade-off
ROHM redesigned the device structure of the new IGBTs, revising both the process and the edge termination structure. The changes raise current density while cutting conduction and switching losses. Short-circuit tolerance and low conduction loss typically pull against each other in IGBT design, since reducing loss tends to narrow the safety margin before a fault condition becomes damaging. ROHM states the 4th generation parts hold a 7 microsecond withstand time at Tj = 25°C despite the lower VCE(sat), which the company frames as evidence the trade-off has been managed rather than removed.
Silicon IGBTs keep their place as SiC takes over traction inverters
The launch lands alongside a broader shift in EV power electronics. As vehicle platforms move to higher voltages, silicon carbide devices are increasingly used in high-power applications such as traction inverters. ROHM’s own framing places the new 650V IGBTs in a different tier of the vehicle, positioned for auxiliary systems with lower power demands rather than the main drive inverter. ROHM says it expects demand for silicon IGBTs in industrial motor and compressor inverters to keep expanding, even as SiC consolidates its position in higher-power traction applications.
Lineup and availability
The initial range covers 12 products in the TO-247N package, split across the RGAxxTS65HR and RGAxxTS65EHR series, plus 10 bare wafer products in the SG83xxWN series. A further 12 products in the TO-247-4L package, the RGAxxTR65HR and RGAxxTR65EHR series, are in development. The TO-247N package products and selected bare wafer products are already available, with online sales running through distributors including DigiKey and Farnell. ROHM has also published SPICE and PLECS simulation models on its website to support circuit design work ahead of sourcing decisions.
ROHM plans to widen the lineup within the same packages and to develop compact surface-mount IGBTs using the TO-263L package alongside top-side cooling variants, according to the announcement. Neither has a confirmed release date. ROHM describes the planned packages as compact and aimed at miniaturisation, though it hasn’t specified which applications the smaller form factor targets.
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