The dam-and-fill process forms a barrier before filling the enclosed area, protecting components while leaving surrounding connections exposed
(Image courtesy of WEVO-CHEMIE)
WEVO-CHEMIE has introduced WEVOPUR 60210 FL T, a polyurethane potting compound developed for selective potting of the multilayer PCBs used in electric vehicle battery management systems. The German materials manufacturer says the system combines electrical insulation, thermal conductivity and mechanical properties tuned for automated dam-and-fill processing, addressing a PCB category that has grown steadily more complex as battery voltages have risen.
Selective potting for increasingly dense BMS PCBs
Battery management systems monitor and control voltages of up to 800 V in electric vehicles, and Wevo notes that the diagnostic, communication and safety functions layered onto these boards have pushed component density higher still. According to the company, WEVOPUR 60210 FL T is formulated to protect that density against mechanical stress, temperature cycling and moisture. It has a Shore hardness of D 40 to 50, a thermal conductivity of 0.8 W/m·K, and a dielectric strength above 20 kV/mm, properties Wevo says work together to reduce stress cracking and solder joint detachment while helping distribute heat across the potted assembly. The formulation is also designed to guard against electrochemical corrosion, a known failure mode where moisture ingress allows conductive migration between closely spaced traces.
The wider industry context supports why this matters now. EV manufacturers are increasingly moving to 800 V architectures to enable faster charging and reduce resistive losses, a shift that concentrates power electronics density and raises the bar for insulation and thermal management on the boards involved. Selective potting, applied only where protection is needed rather than across the whole board, is one route to meeting that requirement without sacrificing access to connectors and test points.
Dam-and-fill enables automated processing
Wevo says the compound’s rheology and thixotropy are calibrated specifically for the dam-and-fill method, in which the material first forms a shape-retaining barrier before filling the enclosed area without trapping air. The company states this allows the process to run on standard two-component mixing and dosing equipment, and that layer thickness and material volume can be adjusted to different PCB geometries by varying process design and application speed.
Wevo positions the material as an extension of its broader polyurethane range for potting applications spanning high-temperature, chemical-resistant and electrically conductive requirements, developed alongside the production processes the compounds are intended to run on.
Stay ahead in the electrification revolution. Explore more breakthroughs from leading innovators in electric commercial transport – visit our news page.